New Perspectives in Software Engineering
Proceedings of the 11th International Conference on Software Process Improvement (CIMPS 2022)
Price for Eshop: 5618 Kč (€ 224.7)
VAT 0% included
New
E-book delivered electronically online
E-Book information
Springer International Publishing
2022
EPub, PDF
How do I buy e-book?
978-3-031-20322-0
3-031-20322-4
Annotation
This book contains the proceedings of the CIMPS Conference held on October 19-21, 2022, Hipocrates University, Acapulco de Juarez, Guerrero, Mexico, that is dedicated to Software Engineering, in particular, software processes improvement, computer security and communication technology, artificial intelligence and data analysis (big data) with a focus on innovation and/or entrepreneurship, bringing together the academic sectors, governmental and industrial that promote the comprehensive development of a culture of research, innovation and competitiveness of organizations dedicated to and/or that make use of Information and Communication Telecommunications. This book presents software engineering with impact in a combination of different fields: Organizational Models, Standards and Methodologies, Knowledge Management, Software Systems, Applications and Tools, Information and Communication Technologies, Information security, Artificial intelligence, Data Analysis. It is used in different domains in which a broad scope of audience is interested in: Software engineers Analyst Project management Consultant Professors in academia Students Corporate heads of firms Senior general managers Managing directors Board directors Academics and researchers in the field both in universities and business schools Information technology directors and managers Quality managers and directors Libraries and information centres serving the needs of the above This book contents are also useful for Ph.D. students, master's and undergraduate students of IT-related degrees such as Computer Science, Information Systems.
Ask question
You can ask us about this book and we'll send an answer to your e-mail.