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Showing books 571-580 from 7074

E-Books - Communications engineering / telecommunications

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Ernst O. G bel, Uwe Siegner

New International System of Units (SI)

Price for Eshop: 3462 Kč (€ 138.5)

Format: E-Book, Publisher: Wiley

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Ernst O. G bel, Uwe Siegner

New International System of Units (SI)

Price for Eshop: 3462 Kč (€ 138.5)

Format: E-Book, Publisher: Wiley

Availability: E-book delivered electronically online

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Dzevad Belkic

Quantum-Mechanical Signal Processing and Spectral Analysis

Price for Eshop: 7507 Kč (€ 300.3)

Format: E-Book, Publisher: CRC Press

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Dzevad Belkic

Quantum-Mechanical Signal Processing and Spectral Analysis

Price for Eshop: 7507 Kč (€ 300.3)

Format: E-Book, Publisher: CRC Press

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Charles Bell

Beginning IoT Projects

Breadboard-less Electronic Projects

Price for Eshop: 929 Kč (€ 37.2)

Format: E-Book, Publisher: Apress

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Fevzi Belli (EDT), Winfried Gorke (EDT)

Fehlertolerierende Rechensysteme / Fault-Tolerant Computing Systems

3. Internationale GI/ITG/GMA-Fachtagung / 3rd International GI/ITG/GMA Conference Bremerhaven, 9.-11. September 1987

Price for Eshop: 2520 Kč (€ 100.8)

Format: E-Book, Publisher: Springer Berlin Heidelberg

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Benjamin Belmudez

Audiovisual Quality Assessment and Prediction for Videotelephony

Price for Eshop: 1971 Kč (€ 78.8)

Format: E-Book, Publisher: Springer International Publishing

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Anatoly Belous

Space Microelectronics Volume 2

Integrated Circuit Design for Space Applications

Price for Eshop: 2930 Kč (€ 117.2)

Format: E-Book, Publisher: Artech House

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Anatoly Belous

Space Microelectronics Vol 1

Modern Spacecraft Classification, Failure, and Electrical Component Requirements

Price for Eshop: 2930 Kč (€ 117.2)

Format: E-Book, Publisher: Artech House

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Fatna Belqasmi (EDT), Hamid Harroud (EDT), Max Agueh (EDT), Rachida Dssouli (EDT), Faouzi Kamoun (EDT)

Emerging Technologies for Developing Countries

First International EAI Conference, AFRICATEK 2017, Marrakech, Morocco, March 27-28, 2017 Proceedings

Price for Eshop: 1267 Kč (€ 50.7)

Format: E-Book, Publisher: Springer International Publishing

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